當(dāng)前位置：深圳市千兆科科技有限公司>>LPDDR5 interposer>>LPDDR5 Mobile Memory Interposers

LPDDR5 Mobile Memory Interposers

返回列表頁(yè)

參考價(jià)

面議

具體成交價(jià)以合同協(xié)議為準(zhǔn)

產(chǎn)品型號(hào)

品牌

廠商性質(zhì)其他

所在地深圳市

在線詢(xún)價(jià) 收藏產(chǎn)品查看聯(lián)系電話

紡織服裝機(jī)械網(wǎng)采購(gòu)部電話：0571-88918531QQ:2568841715

聯(lián)系方式：查看聯(lián)系方式

更新時(shí)間：2024-08-19 10:31:03瀏覽次數(shù)：88次

聯(lián)系我時(shí)，請(qǐng)告知來(lái)自紡織服裝機(jī)械網(wǎng)

產(chǎn)品分類(lèi) 品牌分類(lèi)

  LPDDR5 interposer

全部產(chǎn)品列表

暫無(wú)信息

深圳市千兆科科技有限公司

經(jīng)營(yíng)模式：其他

商鋪產(chǎn)品：49條

所在地區(qū)：廣東深圳市

詢(xún)價(jià) 給他留言

產(chǎn)品簡(jiǎn)介

Low power double-data rate fifth-generation (LPDDR5) mobile memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in handheld devices or applications where low-power and small size is critical. Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to LPDDR5 mobile memory buses for debug and compliance verification...

詳細(xì)介紹

LPDDR5 Mobile Memory Interposers

類(lèi)別：

LPDDR5 interposer
品牌：

NEXUS

Packaging/Modules

LPDDR5 mobile memory is available in standard Ball-Grid-Array (BGA) component packages. Standard BGA packages are soldered directly to the printed circuit board (PCB). Interposers are available for component packages detailed below:

	Interposers			Options
	Oscilloscope		MA Instrument	Options
Package (ChxDb)	EdgeProbe™	Direct Attach	Logic Compliance	Riser	Component Socket
297 Ball	*	?(XH)	*	Yes	No
315 Ball (2×16)	?(XH)	?(XH)	?	Yes	No
436 Ball	*	*	*	Yes	No
441 Ball	*	*	*	Yes	No
496 Ball (4×16)	*	?(XH)	?	Yes	No
Custom	Custom designs are also available. Please contact us.

* If you don’t see what you need, please contact us for the most up to date information.

XH Series

Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.

Attachment Service

Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality.

Electrical Analysis

Electrical analysis is enabled by using either an EdgeProbe, High Density, or Socketed interposer to capture memory activity on an oscilloscope. The oscilloscope is then used to debug, analyze, and verify the analog characteristics of your design. Presenting an accurate representation of the signals under test to the oscilloscope is critical. Nexus interposers provide an unobtrusive interconnect and accurate signal to your oscilloscope.

Logic / Compliance Analysis

Logic analysis is performed using a logic / compliance interposer to capture memory activity on a logic or memory analyzer. The logic or memory analyzer is then used to debug, analyze, and verify the logic (basic protocol) of your design. Compliance analysis uses the same interposers to capture activity on a memory analyzer. The memory analyzer is then used to debug, analyze, margin test, performance analyze, and verify the memory protocol.